Analyzing the extreme process requirements of heterogeneous integration trends for ABF substrates and high-end CCLs
In pursuit of ultimate computing performance and power efficiency, heterogeneous integration using chiplet design has become the mainstream approach for AI chips. This approach integrates different units such as GPUs and HBMs (High-bandwidth Memory) together, heavily relying on ABF (Ajinomoto Build-up Film) substrates as intermediary layers. This architecture places unprecedented demands on the substrate's circuit density, precision, and heat dissipation capabilities, pushing the number of layers to over 20 and linewidth/spacing down to the micrometer level. Simultaneously, the motherboard PCB supporting this "super chip" must also utilize high-grade CCL materials to ensure unimpeded signal transmission from the substrate to the system. This revolution, originating at the chip level, is transmitting immense technological pressure and business opportunities upstream in materials and manufacturing processes…