In the early days, major European and American SiC brand manufacturers such as Wolfspeed, TI, ST, Infineon, Rohm, and even the Japanese brand Rohm, occupied a major share of the market. Especially in the automotive market where modules are the main specification, these peripherals almost dominated the market.

However, with the rapid development of China's domestic electric vehicle market and the deep and extensive presence of China in the SiC industry chain, the substrate model initially adopted from external suppliers has now become independently produced with considerable capacity. Chinese semiconductor companies have gradually overcome and matured in the most bottleneck link of substrate technology. There are many joint ventures with external suppliers, and they have even gone on to become suppliers of substrates. Not to mention the subsequent wafer and packaging processes, which are their cost advantages. China's SiC industry is now almost competitive with external suppliers.