As transmission rates move towards 224G, the PCB industry faces material upgrades and design challenges.
As single-channel transmission rates evolve from 112G to the next-generation 224G, PCB design has moved from the realm of "circuit science" into the realm of "electromagnetism." At such high frequencies, even minute deviations in the roughness of copper foil, the weaving effect of glass fibers, and even the dielectric constant (Dk) and loss factor (Df) of resin materials can cause fatal interference to signals. This presents a dual challenge to the PCB industry: on the materials side, top-tier substrates with lower and more consistent Dk/Df values ​​must be developed; on the design side, advanced simulation software is needed for precise impedance matching and crosstalk analysis. This is not only an upgrade in materials science but also a systemic transformation of the entire PCB design and manufacturing process, an essential path to future ultra-high-speed computing…